Q. Is there a removal method other than with a soldering iron?

A. Yes, with a low temperature controlled warm air bath.

Mount the PC Board horizontally in a cradle. Apply a focused flow of warm air to the PC board directly under the component to be removed. Do not exceed 300 degrees F because typical solder reflows at 361 degrees F.
The heat will be tranfered by conduction through the PC board, to the pads, leads, and component. Apply flux to all leads. Then apply CHIP QUIK to all the leads. A moulton reflow state will be maintained allowing the chip to be removed.

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